JPH0344413B2 - - Google Patents

Info

Publication number
JPH0344413B2
JPH0344413B2 JP60241782A JP24178285A JPH0344413B2 JP H0344413 B2 JPH0344413 B2 JP H0344413B2 JP 60241782 A JP60241782 A JP 60241782A JP 24178285 A JP24178285 A JP 24178285A JP H0344413 B2 JPH0344413 B2 JP H0344413B2
Authority
JP
Japan
Prior art keywords
integrated circuit
turntable
welding
alignment
ribbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60241782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61108144A (ja
Inventor
Juan Aren
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebauchesfabrik ETA AG
Original Assignee
Ebauchesfabrik ETA AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebauchesfabrik ETA AG filed Critical Ebauchesfabrik ETA AG
Publication of JPS61108144A publication Critical patent/JPS61108144A/ja
Publication of JPH0344413B2 publication Critical patent/JPH0344413B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP60241782A 1984-10-30 1985-10-30 集積回路を回路ユニツトに接続して組み立てる方法並びにこの方法を実施する装置 Granted JPS61108144A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8416748 1984-10-30
FR8416748A FR2572619B1 (fr) 1984-10-30 1984-10-30 Procede pour l'assemblage et la connexion de circuits integres a des unites de circuits et machine pour sa mise en oeuvre

Publications (2)

Publication Number Publication Date
JPS61108144A JPS61108144A (ja) 1986-05-26
JPH0344413B2 true JPH0344413B2 (en]) 1991-07-05

Family

ID=9309221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60241782A Granted JPS61108144A (ja) 1984-10-30 1985-10-30 集積回路を回路ユニツトに接続して組み立てる方法並びにこの方法を実施する装置

Country Status (6)

Country Link
US (1) US4672742A (en])
EP (1) EP0180172B1 (en])
JP (1) JPS61108144A (en])
DE (1) DE3567141D1 (en])
FR (1) FR2572619B1 (en])
HK (1) HK131193A (en])

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6444100A (en) * 1987-08-12 1989-02-16 Hitachi Ltd Device for mounting electronic component
EP0322859B1 (en) * 1987-12-28 1993-05-19 Fuji Seiki Machine Works, Ltd. Method and apparatus for solder coating of leads
JPH0642504B2 (ja) * 1989-06-15 1994-06-01 東レエンジニアリング株式会社 インナーリードボンダー
JPH03129844A (ja) * 1989-10-16 1991-06-03 Shinkawa Ltd インナーリードボンデイング装置
JP2740348B2 (ja) * 1989-10-17 1998-04-15 三洋電機株式会社 テープ送出装置のカバーテープ剥離装置
FR2671303B1 (fr) * 1991-01-07 1993-03-26 Ferco Int Usine Ferrures Dispositif pour l'assemblage des pieces intervenant sur une tetiere correspondant a une cremone ou cremone-serrure pour ouvrant oscillo-battant.
JPH04348540A (ja) * 1991-05-27 1992-12-03 Sony Corp フリップチップボンダー
EP0949662A3 (en) * 1998-03-27 2001-08-01 Supersensor (Proprietary) Limited Die transfer method and system
US6584670B2 (en) * 2000-02-21 2003-07-01 Larry J. Costa Electrical terminal implementation device
US6438818B1 (en) * 2000-02-21 2002-08-27 Larry J. Costa Electrical terminal implementation device
US20050034577A1 (en) * 2003-08-14 2005-02-17 Asm Assembly Automation Ltd Apparatus and method for indexing and severing film
US7561057B2 (en) 2004-05-27 2009-07-14 Lawrence Kates Method and apparatus for detecting severity of water leaks

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3559279A (en) * 1968-10-14 1971-02-02 Sperry Rand Corp Method for bonding the flip-chip to a carrier substrate
US3698620A (en) * 1970-03-25 1972-10-17 Motorola Inc Apparatus for connecting lead portions of a lead frame to respective pads on a chip
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3715258A (en) * 1971-03-23 1973-02-06 Bancroft H Corp Integrated circuit die bonding apparatus
CA915318A (en) * 1971-04-27 1972-11-21 M. Dupuis Jean Method and apparatus for manufacture of integrated circuit devices
US4342090A (en) * 1980-06-27 1982-07-27 International Business Machines Corp. Batch chip placement system
JPS59161040A (ja) * 1983-03-03 1984-09-11 Shinkawa Ltd インナ−リ−ドボンダ−

Also Published As

Publication number Publication date
US4672742A (en) 1987-06-16
FR2572619A1 (fr) 1986-05-02
JPS61108144A (ja) 1986-05-26
EP0180172A1 (fr) 1986-05-07
HK131193A (en) 1993-12-03
FR2572619B1 (fr) 1986-12-26
EP0180172B1 (fr) 1988-12-28
DE3567141D1 (en) 1989-02-02

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